Company facts
- Industry
- Semiconductors & Related Devices
- Headquarters
- Boise, Idaho
- Most recent report
- 8-K, filed Aug 26, 2026
- Incorporated
- Delaware
- Filings on record
- 1,001+ filings
- On EDGAR
- CIK 723125
- Fiscal year ends
- September
- Filer status
- Large accelerated filer
Financials 8 of 36
News 8 of 133
Prospectuses and Registrations 8 of 42
- S-8 Registration statement for an employee plan Apr 17, 2026
- 424B5 Prospectus supplement for an offering Apr 25, 2025
- FWP Free writing prospectus Apr 25, 2025
- 424B2 Prospectus supplement for an offering Apr 24, 2025
- S-8 Registration statement for an employee plan Jan 21, 2025
- 424B5 Prospectus supplement for an offering Jan 14, 2025
- FWP Free writing prospectus Jan 13, 2025
- 424B2 Prospectus supplement for an offering Jan 13, 2025
Proxies 8 of 20
- DEFA14A Extra proxy material Nov 25, 2025
- DEF 14A Proxy statement for a shareholder vote Nov 25, 2025
- PRE 14A Preliminary proxy statement Nov 13, 2025
- DEFA14A Extra proxy material Nov 26, 2024
- DEF 14A Proxy statement for a shareholder vote Nov 26, 2024
- DEFA14A Extra proxy material Jan 3, 2024
- DEFA14A Extra proxy material Nov 29, 2023
- DEF 14A Proxy statement for a shareholder vote Nov 29, 2023
Ownership 8 of 752
- 4 Insider reported a trade Aug 28, 2026
- 4 Insider reported a trade Aug 25, 2026
- 144 Notice of a proposed sale of restricted stock Aug 21, 2026
- 4 Insider reported a trade Aug 20, 2026
- 144 Notice of a proposed sale of restricted stock Aug 18, 2026
- 4 Insider reported a trade Jul 28, 2026
- 4 Insider reported a trade Jul 28, 2026
- 4 Insider reported a trade Jul 27, 2026
Other 8 of 18
- SD Conflict minerals disclosure May 20, 2026
- ARS Annual report sent to shareholders Nov 25, 2025
- SD Conflict minerals disclosure May 20, 2025
- ARS Annual report sent to shareholders Nov 26, 2024
- SD Conflict minerals disclosure May 28, 2024
- ARS Annual report sent to shareholders Nov 29, 2023
- SD Conflict minerals disclosure May 25, 2023
- SD Conflict minerals disclosure May 26, 2022
What to read: May 2026 10-Q
SECSift found 4 of 10 sections worth reading, with 3 positive, 13 notable, and 3 negative flags.
Financial Statements (Item 1)
Core financials with massive revenue growth, debt paydown, and new strategic contracts.Notable- Post-period: bought non-marketable equity in a leading AI company.
- Acquired wafer fab in Taiwan for $1.8B cash in March 2026.
- Debt prepayment of $8.5B principal incurred $500M loss in nine months.
- Revolver reduced from $3.5B to $2.0B on May 6, 2026, no borrowings.
- Dividend raised to $0.15/sh in Q3 2026 from $0.115.
- Consideration payable to customers $3.32B, up from $1.19B.
- Income taxes payable in noncurrent liabilities $5.79B, up from $648M.
Management's Discussion (Item 2)
Extraordinary revenue and margin expansion; strategic agreements transform business model.PositiveRisk Factors (Item 1A)
Key company-specific facts: ASP surges, debt drop, trade probes, customer/data center concentration.Notable- DRAM ASP up 140%, NAND ASP up 130% in first nine months 2026 vs 2025, highlighting huge cyclicality.
- CHIPS Act direct funding expanded: Virginia fab added in June 2025, subject to conditions and possible clawbacks.
- Debt carrying value $5.72B as of May 28, 2026, down from $10.14B as of Feb 26, 2026; revolver cut from $3.50B to $2.00B.
Negative- China CAC ban on Micron products (May 2023) continues to impact revenue inside/outside China; further actions possible.
- Top 10 customers made >50% of 2025 revenue; data center end market ~50% of revenue, high concentration risk.
- New Section 232 (Apr 2025) and Section 301 (Feb 2026) trade investigations could lead to tariffs/restrictions on semiconductors.
Unregistered Sales and Repurchases (Item 2)
Buybacks stopped entirely this quarter after $350M last quarter.
What changed: May 2026 vs. Feb 2026
About 5% of MU's May 2026 10-Q is new information. 26 paragraphs were added, 124 changed, and 47 removed. Below are the most important lines SECSift identified.
New
Changed
- Remaining buyback authorization now disclosed: $2.16B of $10B total. Item 1A
- Taiwan fab acquisition completed for $1.8B cash; prior said installments. Item 2
- Acquisition risk factor summary now includes 'and investments' (was 'and/or strategic transactions' only). Item 1A
- Second Idaho fab timeline changed to 'initial wafer output by late calendar 2028' from 'operational by end of 2028'. Item 2
Removed
Everything here comes from Micron Technology Inc's own filings on SEC EDGAR. The filing list is rechecked every hour. SECSift analysis was completed on Aug 19, 2026, from the 10-Q for May 2026.